GB/T 19183.2-2024
电气和电子设备机械结构 户外机壳 第2部分:协调尺寸
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 2: Coordination dimensions
- 实施日期
- 2025-07-01
- ICS 分类
- 31.240
组合使用关键词、标准类型、状态与 ICS 分类,快速定位所需国家标准。
找到 1,403 条
GB/T 19183.2-2024
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 2: Coordination dimensions
GB/T 19183.5-2024
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 3: Environmental requirements, tests and safety aspects
GB/T 19183.1-2024
Mechanical structures for electrical and electronic equipment—Outdoor enclosures—Part 1: Design guidelines
GB/T 44937.4-2024
Integrated circuits—Measurement of electromagnetic emissions—Part 4: Measurement of conducted emissions—1Ω/150Ω direct coupling method
GB/T 42968.4-2024
Integrated circuits—Measurement of electromagnetic immunity—Part 4: Direct RF power injection method
GB/T 41869.4-2024
Optics and photonics—Microlens arrays—Part 4: Test methods for geometrical properties
GB/T 41869.3-2024
Optics and photonics—Microlens arrays—Part 3:Test methods for optical properties
GB/T 44919-2024
Micro-electromechanical systems (MEMS)technology—Bulge test method for measuring mechanical properties of thin films
GB/T 44839-2024
Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials
GB/T 44842-2024
Micro-electromechanical systems (MEMS) technology—Bend testing methods of thin film materials
GB/T 44849-2024
Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials
GB/T 43034.2-2024
Integrated circuits—Measurement of impulse immunity—Part 2: Synchronous transient injection method
GB/T 42968.2-2024
Integrated circuits—Measurement of electromagnetic immunity—Part 2: Measurement of radiated immunity—TEM cell and wideband TEM cell method
GB/T 20870.4-2024
Semiconductor devices—Part 16-4:Microwave intergrated circuits—Switches
GB/T 44815-2024
Lasers and laser-related equipment—Test methods for laser beam polarization parameters
GB/T 44807.1-2024
EMC IC modelling—Part 1:General modelling framework
GB/T 44806.1-2024
Integrated circuits—EMC evaluation of transceivers—Part 1:General conditions and definitions
GB/T 44795-2024
General requirements for integral substrate of System in Package(SiP)
GB/T 44801-2024
Terminology of system in packgae(SiP)
GB/T 44775-2024
Integrated circuit 3D packaging— Requirement for die stack process and evaluation