GB/T 47752-2026
Micro-electromechanical systems (MEMS) technology—Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 47768-2026
Micro-electromechanical systems (MEMS) technology—Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 47749-2026
Micro-electromechanical system (MEMS) technology—Test method for coefficient of linear thermal expansion of micro-electromechanical solid-state material
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.99
GB/T 47753-2026
Micro-electro mechanical systems(MEMS)technology—Technical specification of automotive MEMS semiconductor gas sensor
- 实施日期
- 2027-02-01
- ICS 分类
- 31.200
GB/T 47909-2026
Diamond polycrystal wafers
- 实施日期
- 2027-02-01
- ICS 分类
- 31.260
GB/T 47837.4012-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-12: Prepreg for multilayer printed circuit boards—Non-halogenated multifunctional epoxide woven E-glass prepreg
- 实施日期
- 2027-02-01
- ICS 分类
- 31.180
GB/T 47837.4017-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-17: Prepreg for multilayer printed circuit boards—Non-halogenated epoxide woven E-glass prepreg for lead-free assembly
- 实施日期
- 2027-02-01
- ICS 分类
- 31.180
GB/T 47837.4016-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-16: Prepreg for multilayer printed circuit boards—Non-halogenated multifunctional epoxide woven E-glass prepreg for lead-free assembly
- 实施日期
- 2027-02-01
- ICS 分类
- 31.180
GB/T 47667-2026
Bypass thyristors of converter valves for high-voltage direct current power transmission using voltage sourced converters
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.20
GB/T 47767-2026
Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 47725-2026
Micro-electromechanical systems (MEMS) technology—Requirements for reliability evaluation of three-dimensional structure of through-silicon vias
- 实施日期
- 2026-12-01
- ICS 分类
- 31.200
GB/T 47719-2026
Micro-electromechanical systems (MEMS) technology—Test methods of the performances for MEMS capacitive microphone
- 实施日期
- 2026-09-01
- ICS 分类
- 31.200
GB/T 47598-2026
Acousto-optic crystals
- 实施日期
- 2026-12-01
- ICS 分类
- 31.260
GB/T 47601-2026
Electro-optic crystals
- 实施日期
- 2026-12-01
- ICS 分类
- 31.260
GB/T 42706.9-2026
Electronic components—Long-term storage of electronic semiconductor devices—Part 9:Special cases
- 实施日期
- 2026-11-01
- ICS 分类
- 31.020
GB/T 42709.3-2026
Semiconductor devices—Micro-electromechanical devices—Part 3: Thin film standard test piece for tensile testing
- 实施日期
- 2026-11-01
- ICS 分类
- 31.200
GB/T 42709.2-2026
Semiconductor devices—Micro-electromechanical devices—Part 2: Tensile testing method of thin film materials
- 实施日期
- 2026-11-01
- ICS 分类
- 31.200
GB/T 46567.2-2026
Intelligent computing—Test method for memristor—Part 2:Linearity
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.99
GB/T 47524-2026
Lasers and laser-related equipment—Test method for angle resolved scattering
- 实施日期
- 2026-08-01
- ICS 分类
- 31.260
GB/T 4023.3-2026
Discrete semiconductor devices—Part 3: Signal, switching and regulator diodes
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.10