GB/T 19520.22-2023
Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-110: Residential racks and cabinets for smart houses
- 实施日期
- 2024-06-01
- ICS 分类
- 31.240
GB/T 19520.21-2023
Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-109: Dimensions of chassis for embedded computing devices
- 实施日期
- 2024-06-01
- ICS 分类
- 31.240
GB/T 19520.20-2023
Mechanical structures for electrical and electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-108: Dimensions of R-type subracks and plug-in units
- 实施日期
- 2024-06-01
- ICS 分类
- 31.240
GB/T 30117.4-2023
Photobiological safety of lamps and lamp systems—Part 4: Measuring methods
- 实施日期
- 2024-06-01
- ICS 分类
- 31.260
GB/T 26215-2023
Capacitors for snubber circuits of HVDC transmission system converter valves
- 实施日期
- 2024-03-01
- ICS 分类
- 31.060.70
GB/T 43368-2023
General specification for separable and break-off connectors for aerospace
- 实施日期
- 2024-03-01
- ICS 分类
- 31.220.10
GB/T 4587-2023
Semiconductor devices—Discrete devices—Part 7:Bipolar transistors
- 实施日期
- 2024-04-01
- ICS 分类
- 31.080.30
GB/T 20870.10-2023
Semiconductor devices—Part 16-10: Technology Approval Schedule for monolithic microwave integrated circuits
- 实施日期
- 2024-01-01
- ICS 分类
- 31.200
GB/T 20870.5-2023
Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators
- 实施日期
- 2024-01-01
- ICS 分类
- 31.080.01
GB/T 20870.2-2023
Semiconductor devices—Part 16-2: Microwave integrated circuits—Frequency prescalers
- 实施日期
- 2023-09-07
- ICS 分类
- 31.080.01
GB/T 16515-2023
Potentiometers for use in electronic equipment—Part 5: Sectional specification—Single-turn rotary low-power wirewound and non-wirewound potentiometers
- 实施日期
- 2024-01-01
- ICS 分类
- 31.040.20
GB/T 4937.26-2023
Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model(HBM)
- 实施日期
- 2024-04-01
- ICS 分类
- 31.080.01
GB/T 15651.6-2023
Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes
- 实施日期
- 2024-04-01
- ICS 分类
- 31.080.99
GB/T 8553-2023
Generic specification for enclosures for crystal units
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 22319.6-2023
Measurement of quartz crystal unit parameters—Part 6: Measurement of drive level dependence(DLD)
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 22318.2-2023
Surface acoustic wave (SAW) resonators—Part 2: Guide to the use
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 22318.1-2023
Surface acoustic wave (SAW) resonators—Part 1:Generic specification
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 22317.401-2023
Piezoelectric filters of assessed quality—Part 4-1: Blank detail specification—Capability approval
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 22317.4-2023
Piezoelectric filters of assessed quality—Part 4: Sectional specification—Capability approval
- 实施日期
- 2024-01-01
- ICS 分类
- 31.140
GB/T 42968.8-2023
Integrated circuits—Measurement of electromagnetic immunity—Part 8: Measurement of radiated immunity—IC stripline method
- 实施日期
- 2024-01-01
- ICS 分类
- 31.200