组合使用关键词、标准类型、状态与 ICS 分类，快速定位所需国家标准。
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GB/T 11024.3-2019
Shunt capacitors for a.c. power systems having a rated voltage above 1 000 V—Part 3:Protection of shunt capacitors and shunt capacitor banks
GB/T 11024.2-2019
Shunt capacitors for a.c. power systems having a rated voltage above 1 000 V - Part 2: Ageing testing
GB/T 11024.1-2019
Shunt capacitors for a.c. power systems having a rated voltage above 1 000 V—Part 1:General
GB/T 37275-2018
Test method for lasing threshold and slope efficiency of Nd:YAG laser rods
GB/T 37255-2018
Test method for pyroelectric coefficient of materials under DC bias field
GB/T 37145-2018
Cabinets for low-voltage switchgear—Mechanical structures for drawout functional unit
GB/T 37144-2018
Cabinets for low-voltage switchgear—Electrical mechanical structures
GB/T 37135-2018
Safety requirements for insulated chassis
GB/T 37031-2018
Semiconductor lighting terminology
GB/T 36965-2018
Test method for cross-linking degree of ethylene-vinyl acetate copolymer applied in photovoltaic modules—Differential scanning calorimetry（DSC）
GB/T 36952-2018
Test method for surface scratch resistance of flat panel display（FPD）polarizing film
GB/T 31370.5-2018
Test method of flat panel display (FPD) color filters—Part 5: Contrast ratio
GB/T 29848-2018
Ethylene-vinyl acetate copolymer (EVA) film for PV module
GB/T 19520.18-2018
Mechanical structures for electronic equipment—Dimensions of mechanical structures of the 482.6 mm (19 in) series—Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1
GB/T 19290.6-2018
Modular order for the development of mechanical structures for electronic equipment practices—Part 2-4: Sectional specification—Interface co-ordination dimensions for the 25 mm equipment practice—Adaptation dimensions for subracks or chassis applicable in cabinets or racks in accordance with IEC 60297-3-100 (19 in)
GB/T 13062-2018
Semiconductor devices—Integrated circuits—Part 21-1：Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 11498-2018
Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures
GB/T 5489-2018
Printed circuit board draw
GB/T 4937.30-2018
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.22-2018
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength