GB/T 4937.36-2025
半导体器件 机械和气候试验方法 第36部分:稳态加速度
Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state
- 实施日期
- 2026-07-01
- ICS 分类
- 31.080.01
组合使用关键词、标准类型、状态与 ICS 分类,快速定位所需国家标准。
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GB/T 4937.36-2025
Semiconductor devices—Mechanical and climatic test methods—Part 36:Acceleration,steady state
GB/T 7016-2025
Method of measurement of current noise generated in fixed resistors
GB/T 4937.33-2025
Semiconductor devices—Mechanical and climatic test methods—Part 33: Accelerated moisture resistance—Unbiased autoclave
GB/T 42968.9-2025
Integrated circuits—Measurement of electromagnetic immunity—Part 9: Measurement of radiated immunity—Surface scan method
GB/T 42968.3-2025
Integrated circuits—Measurement of electromagnetic immunity—Part 3: Bulk current injection (BCI) method
GB/T 42968.5-2025
Integrated circuits—Measurement of electromagnetic immunity—Part 5: Workbench Faraday cage method
GB 46865-2025
Safety requirements for optical radiation of consumer laser pointers
GB/T 18334-2025
Specification for flexible multilayer printed boards
GB/T 46609-2025
Test method for neutron-gamma ray detection performance of scintillation crystals
GB/T 46699-2025
Electronic grade tetramethylsilane
GB/T 46717-2025
Semiconductor devices—Metallization stress void test
GB/T 37946.1-2025
Test methods for organic luminescence material—Part 1: Optical tests
GB/T 42706.6-2025
Electronic components—Long-term storage of electronic semiconductor devices—Part 6: Package or finished devices
GB/T 42706.4-2025
Electronic components—Long-term storage of electronic semiconductor devices—Part 4: Storage
GB/T 4937.16-2025
Semiconductor devices—Mechanical and climatic test methods—Part 16: Particle impact noise detection(PIND)
GB/T 46611-2025
Lithium niobate single-crystal thin film for electro-optic modulator
GB/T 46698-2025
Electronic grade titanium tetrachloride
GB/T 46697-2025
Electronic grade octamethyl cyclotetrasiloxane
GB/T 46377-2025
Test methods for liquid crystal mixtures
GB/T 46381-2025
Low radioactive spherical silica powder for integrated circuit packaging