GB/T 47239.8-2026
Semiconductor devices—Flexible and stretchable semiconductor devices—Part 8: Test method for stretchability, flexibility and stability of flexible resistive memory
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.99
GB/T 47158-2026
Shunt power capacitors of the self-healing type for AC systems having a rated voltage above 1 000 V
- 实施日期
- 2026-06-01
- ICS 分类
- 31.060.70
GB/T 38001.63-2026
Flexible display devices—Part 6-3: Mechanical test methods—Impact and hardness tests
- 实施日期
- 2026-06-01
- ICS 分类
- 31.120
GB/T 42706.7-2026
Electronic components—Long-term storage of electronic semiconductor devices—Part 7:Micro-electromechanical devices
- 实施日期
- 2026-09-01
- ICS 分类
- 31.020
GB/T 42706.8-2026
Electronic components—Long-term storage of electronic semiconductor devices—Part 8:Passive electronic devices
- 实施日期
- 2026-09-01
- ICS 分类
- 31.020
GB/T 4937.9-2026
Semiconductor devices—Mechanical and climatic test methods—Part 9:Permanence of marking
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.01
GB/T 15651.13-2026
Semiconductor devices—Part 5-13:Optoelectronic devices—Hydrogen sulphide corrosion test for LED packages
- 实施日期
- 2026-06-01
- ICS 分类
- 31.080.99
GB/T 4937.41-2026
Semiconductor devices—Mechanical and climatic test methods—Part 41:Test method for reliability of non-volatile memory devices
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.01
GB/T 5078-2026
Method for the determination of the space required by capacitors and resistors with unidirectional terminations
- 实施日期
- 2026-06-01
- ICS 分类
- 31.020
GB/T 249-2026
Rule of type designation for discrete semiconductor devices
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.01
GB/T 7247.12-2026
Safety of laser products—Part 12: Safety of free space optical communication systems used for transmission of information
- 实施日期
- 2026-08-01
- ICS 分类
- 31.260
GB/T 6115.3-2026
Series capacitors for power systems—Part 3:Internal fuses
- 实施日期
- 2026-08-01
- ICS 分类
- 31.060.70
GB/T 6115.1-2026
Series capacitors for power systems—Part 1:General
- 实施日期
- 2026-08-01
- ICS 分类
- 31.060.70
GB/T 46973-2026
Technical specifications for high temperature superconducting thin films of microwave passive devices
- 实施日期
- 2026-08-01
- ICS 分类
- 29.050;31.030
GB/Z 102.17-2026
Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
- 实施日期
- —
- ICS 分类
- 31.080.99
GB/T 4937.10-2025
Semiconductor devices—Mechanical and climatic test methods—Part 10: Mechanical shock—Device and subassembly
- 实施日期
- 2026-07-01
- ICS 分类
- 31.080.01
GB/T 6346.2301-2025
Fixed capacitors for use in electronic equipment—Part 23-1: Blank detail specification—Fixed metallized polyethylene naphthalate film dielectric surface mount DC capacitors—Assessment level EZ
- 实施日期
- 2026-07-01
- ICS 分类
- 31.060.30
GB/T 44937.6-2025
Integrated circuits—Measurement of electromagnetic emissions—Part 6: Measurement of conducted emissions—Magnetic probe method
- 实施日期
- 2026-07-01
- ICS 分类
- 31.200
GB/T 20521.4-2025
Semiconductor devices—Part 14-4:Semiconductor sensors—Semiconductor accelerometers
- 实施日期
- 2026-07-01
- ICS 分类
- 31.080.01
GB/T 46822.1-2025
Fixed electric double-layer capacitors for use in electric and electronic equipment—Part 1:Generic specification
- 实施日期
- 2026-07-01
- ICS 分类
- 31.060.10