GB/T 46892-2025
高亮度LED用印制板热导率测试方法
Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
- 实施日期
- 2026-07-01
- ICS 分类
- 31.180
组合使用关键词、标准类型、状态与 ICS 分类,快速定位所需国家标准。
找到 1,403 条
GB/T 46892-2025
Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
GB/T 33772.3-2025
Quality assessment systems—Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
GB/T 44807.3-2025
EMC IC modelling—Part 3: Models of integrated circuits for EMI behavioural simulation—Radiated emissions modelling (ICEM-RE)
GB/T 4937.40-2025
Semiconductor devices—Mechanical and climatic test methods—Part 40: Board level drop test method using a strain gauge
GB/T 6346.1401-2025
Fixed capacitors for use in electronic equipment—Part 14-1: Blank detail specification—Fixed capacitors for electromagnetic interference suppression and connection to the supply mains—Assessment level DZ
GB/Z 107-2025
Semiconductor devices—Scan based ageing level estimation for semiconductor devices
GB/T 4937.25-2025
Semiconductor devices—Mechanical and climatic test methods—Part 25: Temperature cycling
GB/T 46696-2025
Specification for permanent solder mask
GB/T 42706.3-2025
Electronic components—Long-term storage of electronic semiconductor devices—Part 3: Data
GB/T 46789-2025
Semiconductor devices—Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)
GB/T 20521.2-2025
Semiconductor devices—Part 14-2: Semiconductor sensors—Hall elements
GB/T 7017-2025
Method of measurement of non-linearity in resistors
GB/T 4937.24-2025
Semiconductor devices—Mechanical and climatic test methods—Part 24: Accelerated moisture resistance—Unbiased HAST
GB/T 20521.5-2025
Semiconductor devices—Part 14-5:Semiconductor sensors—PN-junction semiconductor temperature sensor
GB/T 4937.29-2025
Semiconductor devices—Mechanical and climatic test methods—Part 29: Latch-up test
GB/T 46788-2025
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
GB/T 4588-2025
Sectional specification for single and double sided rigid printed board
GB/T 4937.44-2025
Semiconductor devices—Mechanical and climatic test methods—Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
GB/T 4937.38-2025
Semiconductor devices—Mechanical and climatic test methods—Part 38: Soft error test method for semiconductor devices with memory
GB/T 5076-2025
Measurement of the dimensions of a cylindrical component with axial terminations