GB/T 47752-2026
Micro-electromechanical systems (MEMS) technology—Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 47768-2026
Micro-electromechanical systems (MEMS) technology—Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 47749-2026
Micro-electromechanical system (MEMS) technology—Test method for coefficient of linear thermal expansion of micro-electromechanical solid-state material
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.99
GB/T 47767-2026
Micro-electromechanical systems (MEMS) technology—Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
- 实施日期
- 2027-02-01
- ICS 分类
- 31.080.99
GB/T 46567.2-2026
Intelligent computing—Test method for memristor—Part 2:Linearity
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.99
GB/T 47562-2026
Micro-electromechanical systems (MEMS) technology—MEMS silicon piezoresistive pressure and temperature composite pressure sensor chip
- 实施日期
- 2026-08-01
- ICS 分类
- 31.080.99
GB/T 47239.9-2026
Semiconductor devices—Flexible and stretchable semiconductor devices—Part 9: Performance testing methods of one transistor and one resistor (1T1R) resistive memory cells
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.99
GB/T 47239.8-2026
Semiconductor devices—Flexible and stretchable semiconductor devices—Part 8: Test method for stretchability, flexibility and stability of flexible resistive memory
- 实施日期
- 2026-09-01
- ICS 分类
- 31.080.99
GB/T 15651.13-2026
Semiconductor devices—Part 5-13:Optoelectronic devices—Hydrogen sulphide corrosion test for LED packages
- 实施日期
- 2026-06-01
- ICS 分类
- 31.080.99
GB/Z 102.17-2026
Semiconductor devices—Discrete devices—Part 17: Magnetic and capacitive coupler for basic and reinforced insulation
- 实施日期
- —
- ICS 分类
- 31.080.99
GB/T 46809.1-2025
Semiconductor devices—Part 19-1: Smart sensors—Control scheme of smart sensors
- 实施日期
- 2026-07-01
- ICS 分类
- 31.080.99
GB/T 20521.2-2025
Semiconductor devices—Part 14-2: Semiconductor sensors—Hall elements
- 实施日期
- 2026-07-01
- ICS 分类
- 31.080.99
GB/T 46567.1-2025
Intelligent computing—Test method for memristor—Part 1:Basic characteristics
- 实施日期
- 2025-10-31
- ICS 分类
- 31.080.99
GB/T 44919-2024
Micro-electromechanical systems (MEMS)technology—Bulge test method for measuring mechanical properties of thin films
- 实施日期
- 2024-11-28
- ICS 分类
- 31.080.99
GB/T 44839-2024
Micro-electromechanical systems (MEMS) technology一Micro-pillar compression test for MEMS materials
- 实施日期
- 2025-02-01
- ICS 分类
- 31.080.99
GB/T 44842-2024
Micro-electromechanical systems (MEMS) technology—Bend testing methods of thin film materials
- 实施日期
- 2024-10-26
- ICS 分类
- 31.080.99
GB/T 44849-2024
Micro-electromechanical systems (MEMS) technology—Forming limit measuring method of metallic film materials
- 实施日期
- 2025-05-01
- ICS 分类
- 31.080.99
GB/T 44529-2024
Micro-electromechanical systems(MEMS)technology—Radio frequency MEMS circulators and isolators
- 实施日期
- 2024-09-29
- ICS 分类
- 31.080.99
GB/T 44517-2024
Micro-electromechanical systems (MEMS) technology—Wafer curvature and cantilever beam deflection test methods for determining residual stresses of MEMS films
- 实施日期
- 2025-04-01
- ICS 分类
- 31.080.99
GB/T 44513-2024
Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application
- 实施日期
- 2025-01-01
- ICS 分类
- 31.080.99