组合使用关键词、标准类型、状态与 ICS 分类，快速定位所需国家标准。
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GB/T 47837.4012-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-12: Prepreg for multilayer printed circuit boards—Non-halogenated multifunctional epoxide woven E-glass prepreg
GB/T 47837.4017-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-17: Prepreg for multilayer printed circuit boards—Non-halogenated epoxide woven E-glass prepreg for lead-free assembly
GB/T 47837.4016-2026
Materials for printed circuit boards and other interconnecting structures—Part 4-16: Prepreg for multilayer printed circuit boards—Non-halogenated multifunctional epoxide woven E-glass prepreg for lead-free assembly
GB/T 19405.4-2025
Surface mounting technology—Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
GB/T 46821-2025
Test methods for device embedded substrate
GB/T 46892-2025
Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs
GB/T 33772.3-2025
Quality assessment systems—Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
GB/T 46696-2025
Specification for permanent solder mask
GB/T 4588-2025
Sectional specification for single and double sided rigid printed board
GB/T 18334-2025
Specification for flexible multilayer printed boards
GB/T 45714.54-2025
Printed circuit board materials—Part 5-4:Sectional specification set for conductive foils and films with or without coatings—Conductive pastes
GB/T 45660-2025
Electronics assembly technology—Electronic modules
GB/T 45713.4-2025
Electronics assembly technology—Part 4: Endurance test methods for solder joint of area array type package surface mount devices
GB/T 33772.2-2025
Quality assessment systems —Part 2: Selection and use of sampling plans for inspection of electronic components and packages
GB/T 45723-2025
Test method for printed board—Monitoring of single plated-through hole(PTH) resistance change during temperature cycling
GB/T 45638-2025
Product package labels for electronic components using bar code and two-dimensional symbologies
GB/T 19405.3-2025
Surface mounting technology—Part 3:Standard method for the specification of components for through hole reflow（THR）soldering
GB/T 44295-2024
Epoxide woven E-glass prepreg for multilayer printed boards
GB/T 43863-2024
Format for LSI—Package—Board interoperable design
GB/T 19247.6-2024
Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method