组合使用关键词、标准类型、状态与 ICS 分类，快速定位所需国家标准。
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GB/T 4937.26-2023
Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）
GB/T 15651.6-2023
Semiconductor devices—Part 5-6: Optoelectronic devices—Light emitting diodes
GB/T 42597-2023
Micro-electromechanical systems technology—Gyroscopes
GB/T 4937.27-2023
Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)
GB/T 4937.32-2023
Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）
GB/T 4937.31-2023
Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）
GB/T 42706.5-2023
Electronic components—Long-term storage of electronic semiconductor devices—Part 5：Die and wafer devices
GB/T 26111-2023
Micro-electromechanical system technology—Terms
GB/T 42191-2023
Test methods of the performances for MEMS piezoresistive pressure-sensitive device
GB/T 4937.23-2023
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.42-2023
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
GB/T 42158-2023
Micro-electromechanical systems technology（MEMS） —Description and measurement methods for micro trench and pyramidal needle structures
GB/T 41852-2022
Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
GB/T 41853-2022
Semiconductor devices—Micro-electromechanical devices—Wafer to wafer bonding strength measurement
GB/T 20995-2020
Static var compensators(SVC)—Testing of thyristor valves
GB/T 15879.4-2019
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
GB/T 37660-2019
Technical specification of power electronic devices for high-voltage direct current (HVDC) transmission using voltage sourced converters (VSC)
GB/T 4937.30-2018
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.22-2018
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.21-2018
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability