GB/T 20521.1-2026
半导体器件 第14-1部分:半导体传感器 传感器总规范
Semiconductor devices—Part 14-1: Semiconductor sensors—Generic specification for sensors
- 实施日期
- 2026-11-01
- ICS 分类
- 31.080.01
组合使用关键词、标准类型、状态与 ICS 分类,快速定位所需国家标准。
找到 78 条
GB/T 20521.1-2026
Semiconductor devices—Part 14-1: Semiconductor sensors—Generic specification for sensors
GB/T 4937.201-2026
Semiconductor devices—Mechanical and climatic test methods—Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
GB/T 7581-2026
Dimensions of outlines for discrete semiconductor devices
GB/T 4023.1-2026
Discrete semiconductor devices—Part 1: Sectional specification
GB/T 11499-2026
Letter symbols for discrete semiconductor devices
GB/T 17573-2026
Semiconductor devices—General
GB/T 47240.4-2026
Semiconductor devices—Semiconductor interface for human body communication—Part 4: Capsule endoscope
GB/T 47240.1-2026
Semiconductor devices—Semiconductor interface for human body communication—Part 1: General requirements
GB/T 4937.28-2026
Semiconductor devices—Mechanical and climate test methods—Part 28: Electrostatic discharge (ESD) sensitivity testing—Charged device model (CDM)—device level
GB/T 4937.9-2026
Semiconductor devices—Mechanical and climatic test methods—Part 9:Permanence of marking
GB/T 4937.41-2026
Semiconductor devices—Mechanical and climatic test methods—Part 41:Test method for reliability of non-volatile memory devices
GB/T 249-2026
Rule of type designation for discrete semiconductor devices
GB/T 4937.10-2025
Semiconductor devices—Mechanical and climatic test methods—Part 10: Mechanical shock—Device and subassembly
GB/T 20521.4-2025
Semiconductor devices—Part 14-4:Semiconductor sensors—Semiconductor accelerometers
GB/T 4937.37-2025
Semiconductor devices—Mechanical and climatic test methods—Part 37: Board level drop test method using an accelerometer
GB/T 4937.8-2025
Semiconductor devices—Mechanical and climatic test methods—Part 8:Sealing
GB/T 30423-2025
High-voltage direct current (HVDC) installations—System tests
GB/T 15879.612-2025
Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)
GB/T 4937.39-2025
Semiconductor devices—Mechanical and climatic test methods—Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
GB/T 4937.40-2025
Semiconductor devices—Mechanical and climatic test methods—Part 40: Board level drop test method using a strain gauge