组合使用关键词、标准类型、状态与 ICS 分类，快速定位所需国家标准。
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GB/T 4937.35-2024
Semiconductor devices—Mechanical and climatic test methods—Part 35: Acoustic microscopy for plastic encapsulated electronic components
GB/T 4937.34-2024
Semiconductor devices—Mechanical and climatic test methods—Part 34:Power cycling
GB/T 20870.5-2023
Semiconductor devices—Part 16-5: Microwave integrated circuits—Oscillators
GB/T 20870.2-2023
Semiconductor devices—Part 16-2: Microwave integrated circuits—Frequency prescalers
GB/T 4937.26-2023
Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）
GB/T 4937.27-2023
Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)
GB/T 4937.32-2023
Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）
GB/T 4937.31-2023
Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）
GB/T 4937.23-2023
Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
GB/T 4937.42-2023
Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
GB/T 4937.30-2018
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.22-2018
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.21-2018
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.20-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
GB/T 4937.201-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
GB/T 4937.19-2018
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.18-2018
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
GB/T 4937.17-2018
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
GB/T 4937.15-2018
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
GB/T 4937.14-2018
Semiconductor devices—Mechanical and climatic test methods—Part 14: Robustness of terminations（lead integrity）